NTMFS4823N
TYPICAL CHARACTERISTICS
1400
1200
1000
800
C iss
V GS = 0 V
T J = 25 ° C
12
10
8
6
QT
V GS
600
400
C oss
4
Q gs
Q gd
200
0
0
C rss
5
10
15
20
25
30
2
0
0
2
4
6
8
10
I D = 30 A
T J = 25 ° C
12
14
1000
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
Qg, TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source and
Drain ? to ? Source Voltage vs. Total Charge
100
V DD = 15 V
I D = 30 A
V GS = 11.5 V
t r
25
20
15
V GS = 0 V
T J = 25 ° C
10
t d(off)
t d(on)
t f
10
5
1
1
10
100
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
R G , GATE RESISTANCE ( W )
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
V SD , SOURCE ? TO ? DRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
100
10
R q JA = 22 ° C/W
Single Pulse
10 m s
100 m s
1 ms
10 ms
30
25
20
I D = 24 A
1 T C = 25 ° C
15
0.1
Surface ? mounted on FR4 board
using 1 in sq. pad size, 1 oz Cu, t < 10 s
R DS(on) Limit
Thermal Limit
dc
10
5
0.01
0.1
1
Package Limit
10
100
0
25
50
75
100
125
150
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
http://onsemi.com
5
T J , STARTING JUNCTION TEMPERATURE ( ° C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
相关PDF资料
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相关代理商/技术参数
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